Vertical Probe Card
MicroProbe’s Apollo vertical probe cards are suitable for area-array and perimeter-layout probing applications, including both flip chip and pre-bump or aluminum pad application. Apollo is the industry-leading flip chip probe card of choice for graphics processors, game console microprocessors, and automotive microcontrollers. Leveraging proprietary manufacturing technology, Apollo delivers excellent reliability and quality for multi-DUT testing, and technology scalability to address a broad range of testing requirements.
Apollo features include:
- Broad range of probe diameters and tip geometries, scalable to 135um pitch
- Proprietary manufacturing technology for reduced Cres and improved wafer yield
- Superior current-carrying capability for enhanced production uptime and quick time-to-market
The QiLin™ probe card is a workhorse test solution for advanced Wafer Level Chip-scale Packaged (WLCSP) devices with a pitch range of 250-500μm. Optimized for superior alignment and planarity, the multi-DUT product delivers robust performance with high reliability in aggressive production regimes. Central to the prober is a unique spring design that uses crown-tipped spring pins as the contact element. This feature delivers the necessary mechanical compliance for solder bump probing, but in a way that minimizes bump damage.
In WLCSP environments, where probe performance is influencing costs more than ever, the QiLin vertical spring-pin product is lowering test time and costs for chipmakers worldwide.