Publications
IEEE Semiconductor Wafer Test Workshop 2011, A Flexible Vertical MEMs Probe Card Technology for Pre-Bump and eWLP Applications |Mike Slessor & Rick Marshall
IEEE Semiconductor Wafer Test Workshop 2011, Evaluation of New Probe Technology on SnAg and Copper Bumps |Wittig, Leong, Hulic
IEEE Semiconductor Wafer Test Workshop 2011, Key Design Parameters to Maximize Probe Current Carrying Capability
Winner of Best Paper-Tutorial in Nature|January Kister
Wafer Probes: 8 Parameters for Current-carrying Capability in Semiconductor Test | January Kister
Semicon West TechSITE North, Meeting the Economic and Technical Challenges of Wafer Test | Mike Slessor
IEEE Semiconductor Wafer Test Workshop 2009, MicroProbe Vx-RF Probe Card Technology |Nagler, Degen, Nouri, Kister & Slessor
IEEE Semiconductor Wafer Test Workshop 2008, MicroProbe Vx-MP Probe Card Technology|Kister & Hopkins
IEEE Semiconductor Wafer Test Workshop 2007, Electrical Contact Resistance – The key Parameters in Probe Card Performance | Kister & Hopkins