Articles

MicroProbe Enhances Wafer Probe Card Reliability with CCC Improvement
Wanted: 3D Chip Testing Solutions and Standards
February 2012
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3D Integration: Not a Windfall for Test | Viewpoint by MicroProbe CEO, Dr. Mike Slessor
Chip Test Equipment Maker MicroProbe Doubles Revenue
December 2011
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Final Test Report: Focus on MicroProbe
September 2011
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Wafer Probe & Copper Pillars: Challenges & Solutions
Viewpoint by MicroProbe CEO, Dr. Mike Slessor
Test in Transition: Emerging Test Solutions & Technologies
Presentation by MicroProbe CEO, Dr. Mike Slessor
Three-dimensional Integration Demands Multi-dimensional Test and Inspection Strategies
The semiconductor probe card market grew by 40% in 2010
Wafer Probes: 8 Parameters for Current-carrying Capability in Semiconductor Test
MicroProbe Introduces MEMS-Based Probe Card for Ultra-Fine Pitch Devices
Probe Card Market is Looking Up
Deloitte Names MicroProbe in its 2008 San Diego Technology Fast 50
Semicon China Vendor Report | Interview with MicroProbe CEO, Mike Slessor