Articles
MicroProbe Enhances Wafer Probe Card Reliability with CCC Improvement
3D Integration: Not a Windfall for Test | Viewpoint by MicroProbe CEO, Dr. Mike Slessor
Wafer Probe & Copper Pillars: Challenges & Solutions
Viewpoint by MicroProbe CEO, Dr. Mike Slessor
Viewpoint by MicroProbe CEO, Dr. Mike Slessor
Test in Transition: Emerging Test Solutions & Technologies
Presentation by MicroProbe CEO, Dr. Mike Slessor
Presentation by MicroProbe CEO, Dr. Mike Slessor

Three-dimensional Integration Demands Multi-dimensional Test and Inspection Strategies
Wafer Probes: 8 Parameters for Current-carrying Capability in Semiconductor Test
MicroProbe Introduces MEMS-Based Probe Card for Ultra-Fine Pitch Devices
Semicon China Vendor Report | Interview with MicroProbe CEO, Mike Slessor
March 2008
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